3U VPX conduction-cooled multi-communication integrated board
Implement multi-bus integration into the defense VPX system.
This is a conduction-cooled multi-protocol carrier board in a 3U VPX form factor. It can accommodate up to 4 modules and can be utilized as a high-reliability communication integration platform for defense and aerospace applications. 【Features】 ■ Consolidates multiple standards onto a single VPX board ■ Supports high-speed transfer with DMA ■ Compatible with conduction cooling and ruggedization options *For more details, please download the PDF or feel free to contact us.
- Company：MAXET
- Price：Other
